Kyocera is one of the leading manufacturers of SiN AMB substrates for a wide range of applications. With our longterm experience and market know how we can offer you the best support - from your first idea until the market launch.
High reliability AMB (ActiveMetalBonding) process
Ti compound - alloy (Ag-Cu)
Brazing Process at 850°C in vacuum ⇒ High adhesion strength Cu to ceramics
High reliabilty due to AMB technology
Various plating options (Ni, NiAu, NiPdAu, direct Ag)