Kyocera to build its largest plant in Japan, increasing production of semiconductor components
Expanded Sendai Plant Campus in Kagoshima will meet increasing demand for semiconductor packages powering ADAS, sensor cameras, 5G and more.
- Semiconductor Components
Kyoto/London − Kyocera Corporation (hereinafter “Kyocera” President: Hideo Tanimoto) today announced a plan to build the largest manufacturing facility it has ever operated in Japan, expanding production capacity for components including organic semiconductor packages and crystal device packages. A signing ceremony held April 20, 2022 was attended by Kagoshima Governor Koichi Shiota, Satsumasendai City Mayor Ryoji Tanaka, and Kyocera officials. Construction is scheduled to begin next month at the company’s Sendai Plant Campus in Kagoshima.
Kyocera will open the new facility in October 2023 to serve these growing trends, aiming for a 4.5-fold increase in production capacity for organic packages at the Sendai Plant Campus, as well as a substantial increase in capacity for crystal device packages.
Kyocera will contribute to the community by stimulating economic development in Kagoshima, creating new employment opportunities through expanded production of semiconductor components in response to global demand.
Outline of New Facility
||Plant No. 23 at Kyocera’s Kagoshima Sendai Campus
|Address||2310-10 Taki-cho, Satsumasendai-shi, Kagoshima Prefecture, Japan|
||Approximately 62.5 billion yen (approx. 488 million U.S. dollars)|
||12,380 m² (133,257 f²), steel construction, 6stories|
||65,530 m² (705,359 f²)
||Construction to begin May 2022
Facility to open October 2023
||Organic packages, crystal device packages
|Expected production level
||Approximately 33 billion yen (approx. 258 million U.S. dollars) per year (April 2024-March 2025)