Componentes semiconductores

Formulario de consulta

MEMS Sensors Packaging

Upgrade your specification and sensing performance with ceramic packaging solutions

High class and low cost ceramic technology

A thinner, smaller surface mount type leadless package or other customized design structure is available for MEMS which have an open air cavity structure or other specifications.

We offer a variety of packages to meet market demands and full support of high design technology to provide optimized packaging solutions for your requirements.


  • 3D design (air cavity type, hermetic sealing availabilities)
  • Small hysteresis (superior properties provide less mechanical stress with MEMS)
  • No deformation during assembly and use (easy to use and respect the performance of MEMS)
  • Wide range for package dimensions (miniaturization)
  • Non magnetic solution available

Reference markets


  • Advanced Driver Assistance System (ADAS)
  • Electronic Stability Control (ESC)


  • 3D virtual reality
  • Wearable electronic devices
  • MEMS sensor packages
  • MEMS sensor packages